Fix exposed pad of WSON-8 footprint

Adjust size of exposed pad and remove copper layers of paste shapes

bgtex.pretty/SOP-WSON-8-1EP_3.9-6x4.9-5.23mm_P1.27mm_EP3.4x4mm.kicad_mod

@@ -1,4 +1,4 @@
-(module SOP-WSON-8-1EP_3.9-6x4.9-5.23mm_P1.27mm_EP3.4x4mm (layer F.Cu) (tedit 5EF4FAC1)
+(module SOP-WSON-8-1EP_3.9-6x4.9-5.23mm_P1.27mm_EP3.4x4mm (layer F.Cu) (tedit 5EFE2921)
   (descr "3.9x4.9mm or 5.28x5.23mm SOP-8 or 6x5mm WSON-8")
   (attr smd)
   (fp_text reference REF** (at 0 -3.615) (layer F.SilkS)
@@ -34,11 +34,11 @@
   (pad 6 smd roundrect (at 3.225 0.635) (size 2.35 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
   (pad 7 smd roundrect (at 3.225 -0.635) (size 2.35 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
   (pad 8 smd roundrect (at 3.225 -1.905) (size 2.35 0.6) (layers F.Cu F.Paste F.Mask) (roundrect_rratio 0.25))
-  (pad 9 smd rect (at 0 0) (size 3.5 4.1) (layers F.Cu F.Mask))
-  (pad "" smd roundrect (at 0.85 -1) (size 1.37 1.61) (layers F.Cu F.Paste) (roundrect_rratio 0.182))
-  (pad "" smd roundrect (at -0.85 -1) (size 1.37 1.61) (layers F.Cu F.Paste) (roundrect_rratio 0.182))
-  (pad "" smd roundrect (at -0.85 1) (size 1.37 1.61) (layers F.Cu F.Paste) (roundrect_rratio 0.182))
-  (pad "" smd roundrect (at 0.85 1) (size 1.37 1.61) (layers F.Cu F.Paste) (roundrect_rratio 0.182))
+  (pad 9 smd rect (at 0 0) (size 3.4 4) (layers F.Cu F.Mask))
+  (pad "" smd roundrect (at 0.85 -1) (size 1.37 1.61) (layers F.Paste) (roundrect_rratio 0.182))
+  (pad "" smd roundrect (at -0.85 -1) (size 1.37 1.61) (layers F.Paste) (roundrect_rratio 0.182))
+  (pad "" smd roundrect (at -0.85 1) (size 1.37 1.61) (layers F.Paste) (roundrect_rratio 0.182))
+  (pad "" smd roundrect (at 0.85 1) (size 1.37 1.61) (layers F.Paste) (roundrect_rratio 0.182))
   (model ${KISYS3DMOD}/Package_SO.3dshapes/SOIC-8_5.275x5.275mm_P1.27mm.wrl
     (at (xyz 0 0 0))
     (scale (xyz 1 1 1))